品質系統

綠色產品符合性聲明

RoHS報告

認證項目 報告編號 下載
RoHS / Sony / Halogen AXIAL:CE/2018/63822-20180726 Download
DO-218:CE/2018/63866-20180627 Download
SMD:CE/2018/63821-20180712 Download
中高壓晶粒:CE/2018/63824-20180712 Download
低壓晶粒:CE/2018/73941-20180726 Download

REACH報告

認證項目 報告編號 下載
REACH AXIAL:CC/2018/50138A-20180525 Download
DO-218:CE/2018/50139A-20180525 Download
SMD:CE/2018/50137A-20180525 Download
中高壓晶粒:CE/2018/50140A-20180525 Download

高可靠性測試項目

試驗項目 試驗條件&持續時間 參考文獻
PRECONDITIONING 150℃ 15MIN/-55℃ / 15MIN 5 CYCLES JESD22 A-113
TA= 125℃ TIME=24 HRS
TA= 85 ℃ RH=85% TIME = 168 HRS
TA = 150℃, TEST @ 0, 500 & 1000 HRS
HIGH TEMPERATURE REVERSE BIAS TA = 150℃, TEST @ 0, 500 & 1000 HRS JESD22 A-108
TEMPERATURE CYCLING TA = -55 to 150 DEG. C., TEST @ 0, 500, & 1000 CYCLES JESD22 A-104
AUTOCLAVE 96 HRS, TA = 121 C, RH= 100 % TEST @ 0 HRS & 96 HRS JESD22 A-102
HIGH HUMIDITY HIGH TEMPERATURE REVERSE BIAS (H3TRB) 85℃/85RH; BIAS @ 80% RATED VOLTAGE. TEST @ 0, 1000 HRS
JESD22 A-101
ESD 330pF/330Ω,CONTACT DISCHARGE ±30KV ISO 10605 Ed.2 AEC Q101-001 and Q-101-005
D.P.A. USE DEVICES THAT PASSED H3TRB & TC AEC Q101-004
PHYSICAL DIMENSION SEE APPLICABLE USER DEVICE PACKAGING SPEC JESD22 B-100
RESISTANCE TO SOLDER HEAT TS = 260 DEG C; TEST PRE & POST JESD22 B-106
SOLDERABILITY TEMP. OF SOLDER POT=245±5℃,TIME= 5~10 SEC J-STD-002
THERMAL RESISTANCE JUNCTION TO AMBIENT AND JUNCTION TO LEAD JESD-24-3, 24-4, 24-6
DIE SHEAR TEST SPEED: 100 UM/SEC MIL-STD-750 Method 2017